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Alternate

HY62V8200BLLST-I-10

SK Hynix Inc

  • PDF:
  • Package: -
  • ROHS:
  • Status: Obsolete
  • 3D Model:
  • Series: -
  • Width: 8 mm
  • Length: 11.8 mm
  • HTS Code: 8542.32.00.41
  • Objectid: 1527302894
  • ECCN Code: 3A991.B.2.A
  • Pin Count: 32
  • Risk Rank: 9.49
  • Technology: CMOS
  • JESD-30 Code: R-PDSO-G32
  • Memory Width: 8
  • Organization: 256KX8
  • Package Code: TSOP1
  • JESD-609 Code: e6
  • Package Shape: RECTANGULAR
  • Package Style: SMALL OUTLINE, THIN PROFILE
  • Surface Mount: YES
  • Terminal Form: GULL WING
  • Memory Density: 2097152 bit
  • Memory IC Type: STANDARD SRAM
  • Operating Mode: ASYNCHRONOUS
  • Terminal Pitch: 0.5 mm
  • Access Time-Max: 100 ns
  • Number of Words: 262144 words
  • Parallel/Serial: PARALLEL
  • Terminal Finish: TIN BISMUTH
  • Part Package Code: TSOP1
  • Seated Height-Max: 1.2 mm
  • Temperature Grade: INDUSTRIAL
  • Terminal Position: DUAL
  • Number of Functions: 1
  • Number of Terminals: 32
  • Package Description: TSOP1,
  • Number of Words Code: 256000
  • Part Life Cycle Code: Obsolete
  • Qualification Status: Not Qualified
  • Package Body Material: PLASTIC/EPOXY
  • Reach Compliance Code: unknown
  • Operating Temperature-Max: 85°C
  • Operating Temperature-Min: -40°C
  • Supply Voltage-Max (Vsup): 3.6 V
  • Supply Voltage-Min (Vsup): 3 V
  • Supply Voltage-Nom (Vsup): 3.3 V

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