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Basics

Details

Alternate

GS840F36AGT-12

GSI Technology

  • PDF:
  • Package: -
  • ROHS:
  • Status: Obsolete
  • 3D Model:
  • Series: -
  • Width: 14 mm
  • Length: 20 mm
  • HTS Code: 8542.32.00.41
  • Objectid: 2026412094
  • ECCN Code: 3A991.B.2.A
  • Pin Count: 100
  • Risk Rank: 9.66
  • Rohs Code: Yes
  • Technology: CMOS
  • Pbfree Code: Yes
  • JESD-30 Code: R-PQFP-G100
  • Memory Width: 36
  • Organization: 128KX36
  • Package Code: LQFP
  • Package Shape: RECTANGULAR
  • Package Style: FLATPACK, LOW PROFILE
  • Surface Mount: YES
  • Terminal Form: GULL WING
  • Memory Density: 4718592 bit
  • Memory IC Type: CACHE SRAM
  • Operating Mode: SYNCHRONOUS
  • Terminal Pitch: 0.65 mm
  • Access Time-Max: 12 ns
  • Number of Words: 131072 words
  • Parallel/Serial: PARALLEL
  • Terminal Finish: PURE MATTE TIN
  • Part Package Code: QFP
  • Seated Height-Max: 1.6 mm
  • Temperature Grade: COMMERCIAL
  • Terminal Position: QUAD
  • Additional Feature: FLOW-THROUGH ARCHITECTURE
  • Number of Functions: 1
  • Number of Terminals: 100
  • Package Description: LQFP,
  • Number of Words Code: 128000
  • Part Life Cycle Code: Obsolete
  • Qualification Status: Not Qualified
  • Package Body Material: PLASTIC/EPOXY
  • Reach Compliance Code: compliant
  • Operating Temperature-Max: 70°C
  • Operating Temperature-Min:
  • Supply Voltage-Max (Vsup): 3.6 V
  • Supply Voltage-Min (Vsup): 3 V
  • Supply Voltage-Nom (Vsup): 3.3 V
  • Moisture Sensitivity Level: 3
  • Peak Reflow Temperature (Cel): 260

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